Embedded Design Engineering Intern

Description

Leidos Defense Systems, is seeking a talentedEmbedded Design Engineering Intern to join a diverse team to create unique solutions for complex problems. We have offices across the United States that provide responsive, cost-effective engineering, scientific, and IT solutions in the defense, space, cyber, and commercial fields. The ideal candidate will thrive in a learning environment that encourages leadership and technical growth.

At Leidos, our mission is to reach, equip, and teach students with an interest in the field of defense and aerospace. Running for over two decades, the internship program has been a staple at Leidos, giving interns hands-on experience in their future career path. With no shortage of work available, interning with Leidos promises growth, experience, and unrivaled opportunity across the US.

This position is anEmbedded Design Engineering Intern in the Electrical Systems Department. The selected candidate will have an opportunity to experience and learn about all phases of the product life cycle from concept development and detailed design through manufacturing, integration, testing, and post-delivery support. The engineer student may be responsible for implementing and testing embedded hardware and firmware on a variety of platforms including FPGAs, microcontrollers, microprocessors, and mixed signal designs. Additional learning opportunities related to digital-signal processing (DSP) design, printed circuit board (PCB) design, experience with technical trade studies, and evaluation of technology improvements will be provided to the engineering student through this internship.

The intern working in this area will develop significant experience in the following areas:

• C, C++, VHDL, Verilog, assembly
• Communication protocols such as: UART, Ethernet, SPI, I2C,CAN bus, etc.
• Hands-on laboratory experience with instrumentation, test equipment, and debug/test methods
• Perform in a collaborative engineering environment working closely with multi-disciplinary teams
• Xilinx FPGA and SoC families and design tools(RFSoC, Xilinx IP Cores, AXI4, AXI-Stream)
• RISC microprocessors architectures (ARM Cortex, Microblaze, PowerPC, RISC-V)
• Memory architectures, types,and caching
• GNU/Linux and developing kernel drivers
• Embedded operating systems (Linux, VxWorks, Integrity, FreeRTOS, uC/OS-II)

Basic Qualification

• Candidate must be currently enrolled in an accredited college / university and currently working towards a Bachelors, Masters, or PhD in Computer Engineering or a related field.
• Candidate must have a GPA of 3.0 or higher.
• Candidate must upload a resume and unofficial transcripts along with application.
• Must be a US Citizen

At Leidos, we don't want someone who "fits the mold"-we want someone who melts it down and builds something better. This is a role for the restless, the over-caffeinated, the ones who ask, "what's next?" before the dust settles on "what's now."

If you're already scheming step 20 while everyone else is still debating step 2... good. You'll fit right in.

For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.

The Leidos pay range for this job level is a general guideline onlyand not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.